- Sistem pentru testarea fizico-mecanică plăcuțelor electronice și a lipiturilor componentelor electronice pe aceasta – Bond Tester – Condor Sigma
- Push, pull, shear, bending and fatigue – as general testing methods
- Ball pull & ball shear
- Cavity shear
- Die shear
- Wedge and ribbon shear
- SMD shear & gull wing leads
- Stud pull, tweezer pull, vector pull
- Ribbon peel & pull
- Wire pull and wire loop height
- Cold Bump Pull
- Copper pillar
- Scratch / coating
- Creep test
- High speed impact
- Lead integrity / Micro torsion
- Lid torque
- Overhanging die
- Passivation layer gold ball shear
- Probe test
- Spring rigidity